This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations of Inventor Kai-ming Liu
Introduction
Kai-ming Liu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging. His work focuses on innovative methods and structures that enhance the performance and reliability of electronic devices.
Latest Patents
Kai-ming Liu holds a patent for a "Package structure and method for forming the same." This patent describes a package structure that includes a die, a first molding surrounding the die, a first redistribution layer (RDL), and an interposer disposed over the first RDL. The structure is designed to improve the electrical connections and overall efficiency of semiconductor devices. The first RDL features a dielectric layer and an interconnect structure that connects to the die, while the second RDL includes additional layers and structures to enhance functionality.
Career Highlights
Kai-ming Liu is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role at the company allows him to work on cutting-edge technologies and contribute to advancements in semiconductor manufacturing.
Collaborations
(Section skipped due to space constraints.)
Conclusion
Kai-ming Liu's innovative work in semiconductor packaging exemplifies the importance of advancements in technology. His contributions continue to influence the industry and pave the way for future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile