Kai-Jih Shih

Title: The Innovative Contributions of Kai-Jih Shih

Introduction

Kai-Jih Shih is a notable inventor based in Milpitas, California. He has made significant contributions to the field of package structure technology. With a total of 3 patents to his name, his work has had a considerable impact on the industry.

Latest Patents

One of his latest patents is a method of forming a package structure. This method includes several steps: an etching step, a laser step, a plating step, and a singulation step. In the etching step, a plurality of cutting streets of a leadframe are etched. The laser step involves removing a plastic package material covering each of the cutting streets via a laser beam. During the plating step, a plurality of plating surfaces are disposed on various areas of the leadframe that do not have the plastic package material. Finally, in the singulation step, the cutting streets of the leadframe are cut to form the package structure.

Career Highlights

Kai-Jih Shih is currently employed at Integrated Silicon Solution Incorporated, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of package structures in the semiconductor industry.

Collaborations

He has collaborated with several talented individuals, including Cheng-Fu Yu and Yi-Jung Liu, who have contributed to his projects and innovations.

Conclusion

Kai-Jih Shih's contributions to the field of package structure technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in semiconductor packaging.