The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2023
Filed:
Dec. 02, 2020
Applicant:
Integrated Silicon Solution Inc., Milpitas, CA (US);
Inventors:
Assignee:
INTEGRATED SILICON SOLUTION INC., Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/38 (2014.01); H01L 23/544 (2006.01); B23K 26/364 (2014.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
B23K 26/38 (2013.01); B23K 26/364 (2015.10); H01L 21/78 (2013.01); H01L 23/544 (2013.01);
Abstract
A method of forming a package structure includes an etching step, a laser step, a plating step and a singulation step. In the etching step, a plurality of cutting streets of a leadframe are etched. In the laser step, a plastic package material covering on each of the cutting streets is removed via a laser beam. In the plating step, a plurality of plating surfaces are disposed on a plurality of areas of the leadframe without the plastic package material. In the singulation step, the cutting streets of the leadframe are cut to form the package structure.