Taichung, Taiwan

Jyun-Hao Yang

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Siliconware Precision Industries, Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jyun-Hao Yang. Retrieved from https://idiyas.com/inventor/jyun-hao-yang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jyun-Hao Yang and His Work in Electronic Packaging

Introduction

Jyun-Hao Yang is an inventor based in Taichung, Taiwan. His patent work includes an electronic-package design intended to reduce magnetic interference between components.

Latest Patents

Yang is associated with 1 patent, titled “Electronic Package and Shielding Part Including Semiconductor Block and Magnetized Layer.” The invention describes an electronic package built on a carrier structure, with an electronic component and a bonded shielding part covered by an encapsulation layer. The shielding part combines a semiconductor block with a magnetized layer. By placing the semiconductor block between the magnetized layer and the electronic component, the design maintains separation that helps prevent the magnetized layer’s field from interfering with the component’s magnetic-field operation.

Career Highlights

Yang is associated with Siliconware Precision Industries, Ltd., a company involved in semiconductor packaging. His patent reflects work on shielding and component arrangement in electronic packages.

Collaborations

Chih-Hsien Chiu and Wen-Jung Tsai are identified as Yang’s coworkers. The provided information does not specify their roles in the patent or their contributions to the invention.

Conclusion

Jyun-Hao Yang’s patent focuses on a semiconductor-block shielding structure designed to protect an electronic component’s magnetic-field operation, highlighting a practical approach to interference management in electronic packaging.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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