Jwu-jiun Yang

Title: Jwu-jiun Yang: Innovator in Substrate Alignment Technologies

Introduction

Jwu-jiun Yang is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of substrate alignment technologies, particularly through his innovative methods that enhance the efficiency of assembling substrates without fiducial marks.

Latest Patents

Jwu-jiun Yang holds 2 patents that focus on advanced alignment methods. His latest patents include:

1. **Alignment method for assembling substrates in different spaces without fiducial mark and its system** - This method involves pre-defining partially standard character regions of two substrates, capturing images, comparing them to build actual coordinate systems, and moving the substrates to an alignment-and-installation space based on calculated offset values.

2. **Alignment method for assembling substrates without fiducial mark** - This method includes steps such as pre-defining character regions, capturing images of a substrate, building an actual coordinate system, and ensuring correct positioning before stacking the substrates for installation.

Career Highlights

Jwu-jiun Yang is affiliated with the Metal Industries Research & Development Centre, where he applies his expertise in substrate alignment technologies. His work has been instrumental in advancing methods that eliminate the need for fiducial marks, thereby streamlining the assembly process.

Collaborations

Throughout his career, Jwu-jiun Yang has collaborated with notable colleagues, including Chorng-Tyan Lin and Chih-chin Wen. These collaborations have contributed to the development of innovative solutions in the field of substrate alignment.

Conclusion

Jwu-jiun Yang's contributions to substrate alignment technologies demonstrate his commitment to innovation and efficiency in manufacturing processes. His patents reflect a deep understanding of the challenges in the field and offer practical solutions that enhance productivity.