Junwei Mu

Title: Innovations of Junwei Mu in Surface Packaging Technology

Introduction

Junwei Mu is a notable inventor based in Dongguan, China. He has made significant contributions to the field of surface packaging technology. His innovative approach has led to the development of a unique patent that addresses common issues in substrate warpage.

Latest Patents

Junwei Mu holds a patent for a "Stiffener ring and surface packaging assembly." This invention provides a stiffener ring designed to correct warpage of a substrate within the surface packaging assembly. The stiffener ring consists of an annular stiffener ring body and an adjustment block, which is fastened to at least one corner of the stiffener ring body. The adjustment block has a lower coefficient of thermal expansion compared to the stiffener ring body. This coordination alleviates the 'M-shape' overpressure phenomenon caused by warpage deformation at high temperatures, thereby reducing substrate warpage and improving the flatness of the surface packaging assembly. He has 1 patent to his name.

Career Highlights

Junwei Mu is currently employed at Huawei Technologies Co., Limited, a leading global provider of information and communications technology (ICT) infrastructure and smart devices. His work at Huawei has allowed him to focus on innovative solutions that enhance product performance and reliability.

Collaborations

Throughout his career, Junwei Mu has collaborated with talented individuals such as Chuncheng Gong and Li Fan. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Junwei Mu's contributions to surface packaging technology exemplify the importance of innovation in addressing industry challenges. His patent for the stiffener ring and surface packaging assembly showcases his commitment to improving product quality and performance.