The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2025
Filed:
Oct. 27, 2022
Huawei Technologies Co., Ltd., Guangdong, CN;
Chuncheng Gong, Shenzhen, CN;
Li Fan, Dongguan, CN;
Weijin Pan, Dongguan, CN;
Junwei Mu, Dongguan, CN;
Ge Zhang, Dongguan, CN;
HUAWEI TECHNOLOGIES CO., LTD., Shenzhen, CN;
Abstract
This application provides a stiffener ring and a surface packaging assembly. The stiffener ring is configured to correct warpage of a substrate of the surface packaging assembly. The stiffener ring includes an annular stiffener ring body and an adjustment block that is disposed at a same layer as the stiffener ring body and that is fastened to at least one corner of the stiffener ring body. A coefficient of thermal expansion of the adjustment block is less than a coefficient of thermal expansion of the stiffener ring body. Coordination between the adjustment block and the stiffener ring body alleviates an 'M-shape' overpressure phenomenon of a warpage deformation caused by the stiffener ring to the substrate at a high temperature, reduces warpage of the substrate, and improves flatness of the surface packaging assembly.