Weijin Pan

Title: Weijin Pan: Innovator in Surface Packaging Technology

Introduction

Weijin Pan is an inventive mind based in Dongguan, China, known for his contribution to the field of surface packaging technology. With a patent to his name, Weijin has showcased his ability to solve complex issues related to substrate warpage in electronic packaging. His innovative approaches have caught the attention of the industry, particularly through his work at a prominent company.

Latest Patents

Weijin Pan holds a patent for a "Stiffener ring and surface packaging assembly." This invention provides a solution to correct warpage in the substrate of surface packaging assemblies. The design includes an annular stiffener ring body and an adjustment block, which is fastened to at least one corner of the stiffener ring body. Notably, the adjustment block features a coefficient of thermal expansion that is less than that of the stiffener ring body. This innovative coordination addresses the 'M-shape' overpressure phenomenon linked to high-temperature warpage, significantly reducing substrate warpage and enhancing the flatness of surface packaging.

Career Highlights

Weijin Pan is currently employed at Huawei Technologies Co., Limited, where he applies his expertise in advancing packaging technologies. His role has allowed him to engage in cutting-edge research and development, contributing to products that are pivotal in the tech industry.

Collaborations

Throughout his career, Weijin has collaborated with fellow innovators, including Chuncheng Gong. This teamwork has likely inspired new ideas and innovations, enhancing the potential for groundbreaking inventions within their projects.

Conclusion

Weijin Pan exemplifies how individual inventors can make significant advancements in technology through innovative solutions. His patent for a stiffener ring and surface packaging assembly not only addresses critical industry challenges but also reflects his dedication to improving electronic packaging standards. His ongoing work at Huawei Technologies Co., Limited continues to contribute to the evolution of the technology landscape in surface packaging.