Junji Tsuruoka

Title: Junji Tsuruoka: Semiconductor Device and Power Module Innovations.

Introduction

Junji Tsuruoka is an inventor associated with Anjo, Japan. His work includes semiconductor devices and power electronics, with 7 patents listed.

Latest Patents

“Semiconductor Device and Method for Fabricating the Same” describes a manufacturing approach intended to protect a circuit pattern and semiconductor chip from sputters produced during laser welding. A connection conductor is soldered to copper foil on a ceramic substrate, and resin is applied in stages around the welding process. The method is designed to prevent sputters from adhering to sensitive components and thereby help preserve the device’s electrical properties.

“Semiconductor Module and Inverter Device” describes a module with a base plate and multiple substrates, each containing a switching element, a diode element, and a connection terminal area. A parallel-flow-forming device creates coolant paths in contact with the opposite side of the base plate, supporting cooling of the module.

Career Highlights

Tsuruoka’s listed company affiliations include Aisin AW Co., Ltd. and Fuji Electric Device Technology Co., Ltd. His patent work reflects an emphasis on semiconductor fabrication, module design, and thermal management.

Collaborations

His listed coworkers include Kazuo Aoki and Seiji Yasui, reflecting professional connections in the semiconductor and electronics fields.

Conclusion

Junji Tsuruoka’s patents address practical challenges in semiconductor manufacturing and power-module cooling, highlighting his contributions to reliable electronic devices.