The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2014

Filed:

Jun. 16, 2010
Applicants:

Junji Tsuruoka, Aichi, JP;

Kazuo Aoki, Aichi, JP;

Masaki Ono, Tokyo, JP;

Katsuhiko Yoshihara, Tokyo, JP;

Inventors:

Junji Tsuruoka, Aichi, JP;

Kazuo Aoki, Aichi, JP;

Masaki Ono, Tokyo, JP;

Katsuhiko Yoshihara, Tokyo, JP;

Assignees:

Aisin AW Co., Ltd., Anjo, JP;

Fuji Electric Co., Ltd., Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device which can prevent a deterioration in the electrical properties by preventing sputters generated by laser welding from adhering to a circuit pattern or a semiconductor chip and a method for fabricating such a semiconductor device are provided. A connection conductor is bonded to a copper foil formed over a ceramic by a solder and resin is injected to a level lower than a top of the connection conductor. Laser welding is then performed. After that, resin is injected. This prevents sputters generated by the laser welding from adhering to a circuit pattern or a semiconductor chip. As a result, a deterioration in the electrical properties can be prevented.


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