Saitama, Japan

Junichi Ujita

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Nippon Micrometal Co., Ltd.. Active years: 2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Junichi Ujita. Retrieved from https://idiyas.com/inventor/junichi-ujita

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: Junichi Ujita - Innovator in Ball Arrangement Technology

Introduction

Junichi Ujita is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of ball arrangement technology, particularly through his innovative patent that enhances the efficiency of mounting balls on various objects.

Latest Patents

Ujita holds a patent for a "Ball arrangement method and arrangement apparatus." This invention allows for the simultaneous mounting of balls on a mounting object by utilizing a ball arrangement device with suction holes. The process involves holding the balls by suction, transcribing flux or solder paste onto them, and then transferring the balls onto the desired surface. This method is particularly effective for fine balls with diameters below 150 µm, ensuring that the properties of the flux remain unchanged and preventing contamination of the surrounding area.

Career Highlights

Junichi Ujita is associated with Nippon Micrometal Co., Ltd., where he continues to develop and refine his innovative technologies. His work has been instrumental in advancing the capabilities of ball arrangement systems, making them more efficient and reliable.

Collaborations

Ujita collaborates with Nobuaki Hayashi, contributing to the development of cutting-edge solutions in the field of ball arrangement technology.

Conclusion

Junichi Ujita's contributions to ball arrangement technology exemplify the impact of innovative thinking in engineering. His patent not only enhances manufacturing processes but also sets a standard for future developments in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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