The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2001

Filed:

Dec. 29, 1999
Applicant:
Inventors:

Nobuaki Hayashi, Tokyo, JP;

Junichi Ujita, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/20 ; B23K 3/102 ;
U.S. Cl.
CPC ...
B23K 1/20 ; B23K 3/102 ;
Abstract

A ball arrangement method and arrangement apparatus for simultaneously mounting balls on a mounting object by the steps of holding the balls by suction on ball suction holes in a ball arrangement device having the ball suction holes arranged, transcribing flux or a solder paste onto the balls held by suction, and transferring the balls onto the mounting object. In the method and apparatus, a flux supplying unit composed of a head plate,at an end thereof is provided, flux supplying nozzles,are arranged over the head plate,at positions corresponding to the ball suction holes,in the ball arrangement device,The flux or the solder paste is transcribed onto surfaces of the balls in such a manner that the flux or the solder paste is filled into the flux supplying nozzles,by supplying the flux or the solder paste from the back of the head plate,and then the balls held by suction on the ball suction holes in the ball arrangement device are brought into contact with the flux supplying nozzles being filled with the flux or the solder paste. The method and apparatus are capable of transcribing flux even onto fine balls below 150 &mgr;m in diameter without producing a change in properties of the flux and polluting the periphery of the apparatus with the flux.


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Hayashi, Nobuaki. (2001). Ball arrangement method and arrangement apparatus (U.S. Patent No. 6302316). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6302316

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