Company Filing History:
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1 out of 1 Years Active: 2006
Title: Innovator Junichi Takenaka and His Contributions to Lead-Free Solder Technologies
Introduction
Junichi Takenaka is an accomplished inventor based in Osaka, Japan, recognized for his significant contributions to the field of electronic components. His innovative spirit and commitment to advancing technology have culminated in the development of a patent that addresses critical issues in soldering processes for electronic devices.
Latest Patents
Takenaka holds a patent for a lead-free solder alloy designed to prevent disconnection and the generation of bridging effects, which can lead to short circuits between terminals. This invention is particularly relevant for electronic components utilizing insulating-coated electric wires, where the core wire is made of copper or copper alloys. The patented alloy consists of specific proportions of copper (3.0 to 5.5 wt %), nickel (0.1 to 0.5 wt %), and germanium (0.001 to 0.1 wt %), with the remainder being tin. This invention significantly enhances the reliability of soldered connections, especially in electronics with closely spaced terminals.
Career Highlights
Throughout his career, Junichi Takenaka has worked for esteemed organizations such as Sumida Corporation and Nihon Genma Manufacturing Co., Ltd., where he honed his expertise in electronic components and materials science. His experience in these roles has been pivotal in shaping his innovative approach and understanding of industry needs.
Collaborations
Takenaka has collaborated with notable colleagues, including Koichi Izumida and Yuki Takano. These partnerships have allowed for a wealth of shared knowledge, contributing to innovations that meet the demands of ever-evolving technological landscapes.
Conclusion
Junichi Takenaka's pioneering work in developing lead-free solder technologies underscores his role as an influential inventor in the electronics sector. His contributions not only mark a step forward in material science but also demonstrate the importance of innovation in driving the future of electronic manufacturing.