The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2006
Filed:
Aug. 30, 2001
Koichi Izumida, Tokyo, JP;
Yuki Takano, Tokyo, JP;
Hitoshi Abe, Tokyo, JP;
Toshiyuki Moribayashi, Osaka, JP;
Koichi Hagio, Osaka, JP;
Junichi Takenaka, Osaka, JP;
Koichi Izumida, Tokyo, JP;
Yuki Takano, Tokyo, JP;
Hitoshi Abe, Tokyo, JP;
Toshiyuki Moribayashi, Osaka, JP;
Koichi Hagio, Osaka, JP;
Junichi Takenaka, Osaka, JP;
Sumida Corporation, Tokyo, JP;
Nihon Genma Mfg. Co., Ltd., Osaka, JP;
Abstract
Prevented is disconnection, and generation of the bridging effect which causes short circuits between terminals, when electric wire having an insulating coating and terminals are soldered together, in electronic components which are constituted using electric wire having an insulating coating, the core wire thereof being copper or a copper alloy, and in which electronic components distances between neighboring terminals are narrow. Electric wire having an insulating coating, the base metal of which is copper, and terminal portions (connection portions) are soldered together by means of a lead-free solder alloy, which contains 3.0 to 5.5 wt % copper (Cu); 0.1 to 0.5 wt % nickel (Ni); and 0.001 to 0.1 wt % germanium (Ge), the remainder of the solder alloy consisting of tin (Sn).