Company Filing History:
1 out of 229 
1 out of 1 Years Active: 2006
Title: Koichi Izumida: Innovator in Lead-Free Solder Technology
Introduction: Koichi Izumida, an inventive spirit based in Tokyo, Japan, has made significant contributions to the field of electronic components through his innovative approach to solder alloys. With a focus on improving electronic connectivity, Izumida's work particularly addresses issues related to disconnection and short circuits in electronic assemblies.
Latest Patents: Izumida holds a notable patent for a lead-free solder alloy that is specifically designed to enhance the reliability of electronic components. This invention prevents disconnection and the generation of bridging effects between terminals when electric wires with insulating coatings are soldered. The innovative solder alloy contains a precise combination of materials, including 3.0 to 5.5 wt % copper (Cu), 0.1 to 0.5 wt % nickel (Ni), and 0.001 to 0.1 wt % germanium (Ge), with the remainder consisting of tin (Sn). This formulation ensures strong connections in components where the spacing between neighboring terminals is narrow.
Career Highlights: Throughout his career, Koichi Izumida has been associated with prominent companies in the electronics industry, including Sumida Corporation and Nihon Genma Manufacturing Co., Ltd. His expertise in solder technology has been instrumental in advancing the reliability of electronic devices.
Collaborations: Izumida has collaborated with several talented individuals in the industry, including Yuki Takano and Hitoshi Abe. These collaborations have further enriched his work and contributed to the breakthroughs in solder technology.
Conclusion: Koichi Izumida's dedication to innovation in the field of lead-free solder alloys has resulted in a significant patent that addresses critical challenges in electronic component manufacturing. His contributions continue to have a lasting impact on the industry, enhancing the performance and reliability of myriad electronic devices.