Company Filing History:
1 out of 229 
1 out of 1 Years Active: 2006
Title: Koichi Hagio: Innovator in Lead-Free Solder Technology
Introduction
Koichi Hagio is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of electronic components, particularly through his innovative work on lead-free solder alloys. His inventions have played a crucial role in enhancing the reliability and safety of electronic devices.
Latest Patents
Hagio holds a patent for a lead-free solder alloy and the electronic components that utilize it. This invention addresses critical issues such as disconnection and the generation of bridging effects, which can lead to short circuits between terminals. The patented solder alloy consists of 3.0 to 5.5 wt % copper (Cu), 0.1 to 0.5 wt % nickel (Ni), and 0.001 to 0.1 wt % germanium (Ge), with the remainder being tin (Sn). This formulation is particularly effective for electronic components that use electric wires with insulating coatings, where the core wire is made of copper or a copper alloy.
Career Highlights
Throughout his career, Koichi Hagio has worked with prominent companies in the electronics industry. He has been associated with Sumida Corporation and Nihon Genma Manufacturing Co., Ltd., where he has contributed to various projects and innovations. His expertise in solder technology has made him a valuable asset in these organizations.
Collaborations
Hagio has collaborated with several professionals in his field, including Koichi Izumida and Yuki Takano. These collaborations have fostered a creative environment that has led to advancements in electronic component technology.
Conclusion
Koichi Hagio's contributions to lead-free solder technology have significantly impacted the electronics industry. His innovative patent addresses critical challenges in electronic component manufacturing, ensuring greater reliability and safety in devices. His work continues to influence the development of advanced electronic solutions.