Jungsoo Byun

Title: Innovations by Jungsoo Byun in Semiconductor Technology

Introduction

Jungsoo Byun is a prominent inventor based in Seoul, South Korea, known for his significant contributions to semiconductor technology. With a total of five patents to his name, Byun has made remarkable advancements in the field, particularly in the design and functionality of semiconductor packages.

Latest Patents

Among his latest patents, Byun has developed an innovative interposer and semiconductor package. The semiconductor package includes an interposer, first and second semiconductor chips, and electrical connection structures. The interposer features a first connection structure with a first redistribution conductor, along with multiple second and third connection structures, each equipped with their respective redistribution conductors. This design allows for efficient electrical connections between the semiconductor chips, enhancing the overall performance of the package. Another notable patent involves a semiconductor package that comprises a frame with a through-opening, where the first semiconductor chip is placed. This package design includes various electrical connections, ensuring optimal functionality and reliability.

Career Highlights

Jungsoo Byun is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to collaborate with some of the brightest minds in the field, contributing to groundbreaking innovations in semiconductor technology.

Collaborations

Byun has worked alongside talented colleagues such as Doohwan Lee and Taesung Jeong. Their collaborative efforts have led to advancements that push the boundaries of semiconductor design and application.

Conclusion

Jungsoo Byun's contributions to semiconductor technology through his innovative patents and collaborations at Samsung Electronics Co., Ltd. highlight his role as a key figure in the industry. His work continues to influence the development of advanced semiconductor packages, showcasing the importance of innovation in technology.