The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2023
Filed:
Sep. 18, 2020
Samsung Electronics Co., Ltd., Suwon-si, KR;
Choongbin Yim, Seoul, KR;
Jungwoo Kim, Osan-si, KR;
Jihwang Kim, Cheonan-si, KR;
Jungsoo Byun, Seoul, KR;
Jongbo Shim, Asan-si, KR;
Doohwan Lee, Cheonan-si, KR;
Kyoungsei Choi, Yongin-si, KR;
Junggon Choi, Seongnam-si, KR;
Sungeun Pyo, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes: a redistribution layer including a plurality of redistribution insulating layers, a plurality of redistribution line patterns that constitute lower wiring layers, and a plurality of redistribution vias that are connected to some of the plurality of redistribution line patterns while penetrating at least one of the plurality of redistribution insulating layers; at least one semiconductor chip arranged on the redistribution layer; an expanded layer surrounding the at least one semiconductor chip on the redistribution layer; and a cover wiring layer including at least one base insulating layer, a plurality of wiring patterns that constitute upper wiring layers, and a plurality of conductive vias that are connected to some of the plurality of wiring patterns while penetrating the at least one base insulating layer.