Seoul, South Korea

Junghyun Ryu

This inventor holds 2 USPTO granted patents. Top assignee: Seoul National University. Active years: 2017-2019.


% Patents Active = 100.0

Average Co-Inventor Count = 5.5

ph-index = 1


Company Filing History:


Years Active: 2017-2019

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2 patents (USPTO):Explore Patents

Title: Innovations of Junghyun Ryu

Introduction

Junghyun Ryu is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of flexible materials and deformation sensing technologies. With a total of 2 patents, Ryu's work showcases his innovative approach to solving complex engineering challenges.

Latest Patents

Ryu's latest patents include a "Sequential joint behavior sheet using photo deformation and method of controlling folding and unfolding thereof." This invention features a sequential joint behavior sheet that consists of at least three rigid parts, with joint parts that allow for controlled folding and unfolding based on light absorption. The design incorporates print patterns with varying degrees of transparency, enabling a sequential folding behavior.

Another notable patent is the "Deformation sensing flexible substrate using pattern formed of conductive material." This invention utilizes a flexible substrate with conductive patterns that respond to deformation. The arrangement of conductors allows for both contact and non-contact configurations, enhancing the functionality of flexible electronic devices.

Career Highlights

Junghyun Ryu is affiliated with Seoul National University, where he continues to advance research in innovative materials and technologies. His academic background and research contributions have positioned him as a leading figure in his field.

Collaborations

Ryu has collaborated with notable colleagues, including Maenghyo Cho and Jong Gu Lee. Their joint efforts have furthered the development of cutting-edge technologies in flexible materials.

Conclusion

Junghyun Ryu's inventive spirit and dedication to research have led to significant advancements in flexible materials and deformation sensing technologies. His contributions are paving the way for future innovations in the field.

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