The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
Mar. 11, 2015
Applicant:
Seoul National University R&db Foundation, Seoul, KR;
Inventors:
Maenghyo Cho, Seoul, KR;
Kyu Jin Cho, Seoul, KR;
Junghyun Ryu, Seoul, KR;
Je Sung Koh, Seoul, KR;
Jong Gu Lee, Seoul, KR;
Assignee:
Seoul National University R&DB Foundation, Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 27/08 (2006.01); H05K 1/02 (2006.01); H05K 3/12 (2006.01); G01B 7/16 (2006.01); G01R 27/02 (2006.01); G01N 27/00 (2006.01); G01R 27/00 (2006.01); G01N 27/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); G01B 7/20 (2013.01); G01R 27/08 (2013.01); H05K 1/02 (2013.01); H05K 3/12 (2013.01); G01N 27/00 (2013.01); G01N 27/02 (2013.01); G01R 27/00 (2013.01); G01R 27/02 (2013.01); H05K 2201/07 (2013.01);
Abstract
Disclosed herein is a deformation sensing flexible substrate using a pattern formed of a conductive material. The deformation sensing flexible substrate, using the pattern formed of the conductive material, includes a flexible substrate; and conductive patterns in which conductors including a conductive material are arranged and formed to be contactable and non-contact to each other based on deformation of the flexible substrate.