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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9699894 B1

PDFFull Text
Date of Patent:
Jul. 04, 2017

Filed:

Mar. 11, 2015

Deformation sensing flexible substrate using pattern formed of conductive material

Applicant:

Seoul National University R&db Foundation, Seoul, KR;

Inventors:

Maenghyo Cho, Seoul, KR;

Kyu Jin Cho, Seoul, KR;

Junghyun Ryu, Seoul, KR;

Je Sung Koh, Seoul, KR;

Jong Gu Lee, Seoul, KR;

Assignee:

Seoul National University R&DB Foundation, Seoul, KR;

Attorney:

Osha Liang LLP

Primary Examiner:

Hoai-An D Nguyen

Int. Cl.
CPC ...
G01R 27/08 (2006.01); H05K 1/02 (2006.01); H05K 3/12 (2006.01); G01B 7/16 (2006.01); G01R 27/02 (2006.01); G01N 27/00 (2006.01); G01R 27/00 (2006.01); G01N 27/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); G01B 7/20 (2013.01); G01R 27/08 (2013.01); H05K 1/02 (2013.01); H05K 3/12 (2013.01); G01N 27/00 (2013.01); G01N 27/02 (2013.01); G01R 27/00 (2013.01); G01R 27/02 (2013.01); H05K 2201/07 (2013.01);
Abstract

Disclosed herein is a deformation sensing flexible substrate using a pattern formed of a conductive material. The deformation sensing flexible substrate, using the pattern formed of the conductive material, includes a flexible substrate; and conductive patterns in which conductors including a conductive material are arranged and formed to be contactable and non-contact to each other based on deformation of the flexible substrate.

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Cho, Maenghyo. (2017). Deformation sensing flexible substrate using pattern formed of conductive material (U.S. Patent No. 9699894). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9699894

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