JungHwan Um

Introduction

JungHwan Um, an accomplished inventor based in Seongnam-si, South Korea, has significantly contributed to the field of semiconductor fabrication. With a total of three patents to his name, he continues to push the boundaries of innovation within his industry.

Latest Patents

JungHwan Um's latest patents showcase his expertise and creativity in semiconductor device fabrication. One notable patent describes a system for fabricating a semiconductor device, which includes an electrostatic chuck for substrate loading and a complex arrangement of power transmission components. The design optimizes efficiency by incorporating an impedance matcher between the power source and the electrostatic chuck, ensuring precise power delivery.

Another significant patent involves a ring assembly and chuck assembly. This invention features an edge ring designed to enclose a chuck body that supports a substrate. Its innovative design includes multiple surfaces and flow holes, enhancing the functionality and performance of the assembly during fabrication.

Career Highlights

Currently, JungHwan Um is employed at Samsung Electronics Co., Ltd., where he leverages his expertise to contribute to advanced technologies in the semiconductor sector. His work has not only resulted in valuable patents but has also influenced the company's progress in semiconductor innovation.

Collaborations

Throughout his career, JungHwan Um has collaborated with notable colleagues, including Sunghyup Kim and Dong-wook Kim. Their teamwork has fostered a creative environment that has led to significant advancements in semiconductor technology.

Conclusion

JungHwan Um’s profound impact on semiconductor fabrication through his innovative patents reflects his dedication to research and development. As he continues to explore new ideas and technologies, his contributions will undoubtedly shape the future of the semiconductor industry.