The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2020

Filed:

Mar. 27, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

SungHyup Kim, Hwaseong-si, KR;

Dong-Wook Kim, Seoul, KR;

Sungmoon Park, Suwon-si, KR;

JungHwan Um, Seongnam-si, KR;

Taeseok Oh, Anyang-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01J 37/32 (2006.01); H01L 21/3065 (2006.01); H01L 21/673 (2006.01); H01L 21/68 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67063 (2013.01); H01J 37/32642 (2013.01); H01L 21/3065 (2013.01); H01L 21/67 (2013.01); H01L 21/6732 (2013.01); H01L 21/68 (2013.01); H01L 21/68735 (2013.01);
Abstract

A ring assembly and a chuck assembly therewith are provided. The ring assembly may include an edge ring that is provided to enclose a chuck body supporting a substrate. The edge ring may include a first top surface, a second top surface positioned outside the first top surface and above the first top surface, a first inner side surface connecting the first top surface to the second top surface, and at least one first flow hole extending outward from one of the first top surface and the first inner side surface, thereby penetrating the edge ring.


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