Company Filing History:
Years Active: 2020-2022
Title: Innovations of Junghwan Byun in Flexible Substrates
Introduction
Junghwan Byun is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of flexible substrates, holding a total of 4 patents. His work focuses on enhancing the functionality and application of stretchable materials in electrical circuits.
Latest Patents
Among his latest patents is a method for forming a flexible substrate that includes a via. This invention provides an electrical connection between the two surfaces of the stretchable substrate. It features a buffer shell that has a Young's modulus value greater than that of the stretchable substrate but smaller than that of the via. Another significant patent is an apparatus for fabricating a stretchable electrical circuit. This apparatus includes a stretching device, a marking device, an image device, and a control device, all working together to create precise electrical circuits on stretchable substrates.
Career Highlights
Junghwan Byun is affiliated with Seoul National University, where he continues to innovate and research in the field of flexible electronics. His work has garnered attention for its potential applications in various industries, including wearable technology and flexible displays.
Collaborations
He has collaborated with notable colleagues such as Yongtaek Hong and Byeongmoon Lee, contributing to advancements in their shared field of research.
Conclusion
Junghwan Byun's innovative work in flexible substrates and electrical circuits showcases his commitment to advancing technology. His patents reflect a deep understanding of material science and engineering, paving the way for future developments in flexible electronics.