The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2021
Filed:
Sep. 22, 2017
Applicant:
Seoul National University R&db Foundation, Seoul, KR;
Inventors:
Yongtaek Hong, Seoul, KR;
Eunho Oh, Seoul, KR;
Junghwan Byun, Seoul, KR;
Byeongmoon Lee, Chungcheong buk-do, KR;
Assignee:
SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION, Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/40 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0283 (2013.01); H05K 1/115 (2013.01); H05K 3/361 (2013.01); H05K 3/4061 (2013.01);
Abstract
A method for forming a flexible substrate having a via, according to the present embodiment, comprises the steps of: (a) arranging a mixture of conductive particles moving by means of a magnetic field, when a curable resin and the magnetic field are provided; (b) forming a material layer being cured and having flexibility; (c) arranging the conductive particles by providing a magnetic field; and (d) curing the curable resin and the material layer.