This inventor holds 5 USPTO granted patents and 3 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2020-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2020-2026
Title: Innovative Advances by Inventor Jungeun Koo
Introduction
Jungeun Koo is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of electronics, specifically in the development of advanced packaging solutions. With a total of three patents to his name, Koo's innovations showcase his expertise in chip-on-film technology and display apparatuses.
Latest Patents
Among his latest patents, Koo has focused on pioneering chip-on-film packages and display apparatuses. One of his notable inventions is a chip-on-film package featuring a base film with a circuit region, where both a source driver chip and a gate driver chip are mounted. This innovative design includes conductive lines and bonding pads that enhance the functionality and performance of electronic devices. Additionally, he has developed a film package that incorporates output and input patterns allowing for efficient energy transfer and signal processing across the film substrate.
Career Highlights
Jungeun Koo is affiliated with Samsung Electronics Co., Ltd., a leading company in the electronics industry. His role at Samsung highlights his commitment to advancing technology and fostering innovation in electronic packaging. His contributions not only enhance product performance but also strengthen Samsung's position as a leader in the technology market.
Collaborations
Throughout his career, Koo has worked alongside talented individuals such as Yechung Chung and Minhwa Jang. Their collaboration has proven fruitful in advancing technology and developing cutting-edge inventions. Working with skilled colleagues allows for the exchange of ideas and a collective approach to solving engineering challenges.
Conclusion
Jungeun Koo's innovative work in chip-on-film technology and his contributions to the electronics industry are commendable. His patents reflect the ongoing advancements in electronic packaging, which are essential for modern devices. As Koo continues to develop new inventions, he plays a vital role in shaping the future of electronics and technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile