Jung Youn Pang

Title: Jung Youn Pang: Innovator in Electroless Surface Treatment Technology

Introduction

Jung Youn Pang is a notable inventor based in Gunspo-si, South Korea. He has made significant contributions to the field of printed circuit board technology. With a total of 3 patents to his name, his work focuses on enhancing the quality and efficiency of electroless surface treatment processes.

Latest Patents

One of Jung Youn Pang's latest patents is titled "Electroless surface treatment plated layers of printed circuit board and method for preparing the same." This invention details an electroless surface treatment plated layer that includes electroless nickel (Ni), palladium (Pd), and gold (Au) plated coatings. The thicknesses of these coatings are meticulously defined, with nickel ranging from 0.02 to 1 µm, palladium from 0.01 to 0.3 µm, and gold from 0.01 to 0.5 µm. The innovation allows for an optimized electroless Ni/Pd/Au surface treatment plated layer, which is crucial for improving the performance of printed circuit boards.

Career Highlights

Jung Youn Pang is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to develop cutting-edge technologies in the electronics sector. His expertise in electroless plating processes has positioned him as a key player in advancing the capabilities of printed circuit boards.

Collaborations

Throughout his career, Jung has collaborated with talented individuals such as Seong Min Cho and Chi Seong Kim. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Jung Youn Pang's contributions to the field of electroless surface treatment technology are noteworthy. His patents reflect a commitment to enhancing the functionality of printed circuit boards, making him a significant figure in the industry.