Samsung Electro-mechanics Co., Ltd.

Jung Youn Pang

Chi Seong Kim

Seong Min Cho

Dong Jun Lee

Dong Ju Jeon

Eun Heay Lee

Shimoji Teruaki

An electroless surface treatment plated layer of a printed circuit board, a method for preparing the same, and printed circuit board including the same. The electroless surface treatment plated layer includes: electroless nickel (Ni) plated coating/palladium (Pd) plated coating/gold (Au) plated coating, wherein the electroless nickel, palladium, and gold plated coatings have thicknesses of 0.02 to 1 &#x3bc;m, 0.01 to 0.3 &#x3bc;m, and 0.01 to 0.5 &#x3bc;m, respectively. In the electroless surface treatment plated layer of the printed circuit board, a thickness of the nickel plated coating is specially minimized to 0.02 to 1 &#x3bc;m, thereby making it possible to form an optimized electroless Ni/Pd/Au surface treatment plated layer.

Electroless surface treatment plated layers of printed circuit board and method for preparing the same

There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd&#x2014;P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.

Electrode pad, printed circuit board using the same, and method of manufacturing printed circuit board

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Gunspo-si, South Korea

Jung Youn Pang