Jung-Su Ryu

Title: Innovations of Jung-Su Ryu in Semiconductor Technology

Introduction

Jung-Su Ryu is a notable inventor based in Seongnam-shi, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on improving the efficiency and reliability of semiconductor devices.

Latest Patents

One of his latest patents is titled "Semiconductor device having test element groups." This invention defines a plurality of chip regions over a semiconductor substrate, which are separated by a scribe region. The design includes multiple main pads located in the chip regions, with a test element group positioned at the scribe region. This test element group is electrically connected to the main pads through interconnections. Another significant patent is the "Bonding pad arrangement method for semiconductor devices." This innovation provides various pad arrangements aimed at reducing bonding failures, particularly those caused by shorts. It also addresses the reduction of length differences between bonding wires to decrease signal skew during the operation of semiconductor devices, thereby improving signal integrity.

Career Highlights

Jung-Su Ryu is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to contribute to cutting-edge advancements in semiconductor technology.

Collaborations

Throughout his career, Jung-Su Ryu has collaborated with talented individuals such as Eun-Han Kim and Ho-Cheol Lee. These collaborations have further enhanced the innovative outcomes of his projects.

Conclusion

Jung-Su Ryu's contributions to semiconductor technology through his patents demonstrate his commitment to innovation and excellence in the field. His work continues to influence the development of reliable and efficient semiconductor devices.