The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2005

Filed:

Jun. 20, 2003
Applicants:

Ho-cheol Lee, Yongin-shi, KR;

Jae-hoon Kim, Suwon-shi, KR;

Jung-su Ryu, Seongnam-shi, KR;

Inventors:

Ho-Cheol Lee, Yongin-shi, KR;

Jae-Hoon Kim, Suwon-shi, KR;

Jung-Su Ryu, Seongnam-shi, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/50 ; H01L023/48 ;
U.S. Cl.
CPC ...
Abstract

A variety of pad arrangements are provided for semiconductor devices for reducing the likelihood of bonding failures, particularly those due to shorts, and/or for reducing the difference in length between bonding wires to decrease signal skew during operation of the semiconductor device and improve signal integrity.


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