This inventor holds 2 USPTO granted patents. Top assignee: Hewlett-Packard Company. Active years: 1992-1994.
Company Filing History:
Years Active: 1992-1994
Title: Jung Lin - Innovator in Integrated Circuit Technology
Introduction
Jung Lin is a notable inventor based in Cupertino, CA, who has made significant contributions to the field of integrated circuit technology. With a total of 2 patents, he has developed innovative methods that enhance the performance and reliability of interconnect materials used in submicron integrated circuits.
Latest Patents
One of Jung Lin's latest patents is titled "Nitridation of titanium-tungsten interconnects." This method addresses the inherent instability of titanium-tungsten to oxidation by employing a nitridation process. The process involves exposing the interconnect to an ambient containing nitrogen (NH.sub.3) at elevated temperatures, typically through rapid thermal annealing. This technique allows for the formation of local interconnects, enabling the deposition of insulating layers at high temperatures without causing oxidation that could adversely affect the resistivity of the material.
Another significant patent is the "Method of forming and etching titanium-tungsten interconnects." This method focuses on creating a local interconnect for silicon substrates with integrated circuit devices. It involves forming titanium disilicide on electrode regions, followed by the deposition of titanium-tungsten across the silicon substrate. A photomask is then patterned to cover selected portions of the titanium-tungsten layer, allowing for a series of etching processes that ultimately leave an electrically conductive interconnect extending from an electrode region onto a dielectric region.
Career Highlights
Jung Lin is currently employed at Hewlett-Packard Company, where he continues to innovate in the field of integrated circuits. His work has been instrumental in advancing the technology used in modern electronic devices.
Collaborations
Throughout his career, Jung Lin has collaborated with notable colleagues, including Warren M. Uesato and John E. Turner. These collaborations have contributed to the development of cutting-edge technologies in the semiconductor industry.
Conclusion
Jung Lin's contributions to integrated circuit technology through his patents and work at Hewlett-Packard Company highlight his role as a key innovator in the field. His methods for improving interconnect materials are essential for the advancement of electronic devices.