Jung-Kun Kang

Title: Innovations by Jung-Kun Kang in Multi-Chip Module Technology

Introduction

Jung-Kun Kang is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of multi-chip modules. With a total of 4 patents to his name, Kang's work has advanced the efficiency and functionality of electronic devices.

Latest Patents

Kang's latest patents include innovative designs that enhance multi-chip modules. One of his notable inventions is a "Multi-chip module with embedded package and method for manufacturing the same." This invention features a first package that includes a substrate, a first chip, an encapsulant, and solder balls. The design allows for a second package to be embedded within the first, facilitating external connections through solder balls and electrical terminals.

Another significant patent is the "Multi-chip stack package." This invention comprises a substrate, a first chip, a redistribution structure, and at least one second chip. The design optimizes the connection length of bonding wires, improving electrical conduction between the second chip and the substrate.

Career Highlights

Jung-Kun Kang is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor technologies. His work has been instrumental in pushing the boundaries of multi-chip module designs, making them more efficient and reliable.

Collaborations

Kang has collaborated with several talented individuals in his field, including Yu-Fang Tsai and Tsung-Yueh Tsai. These collaborations have contributed to the successful development of his patented technologies.

Conclusion

Jung-Kun Kang's contributions to multi-chip module technology reflect his expertise and dedication to innovation in the semiconductor industry. His patents not only enhance the functionality of electronic devices but also pave the way for future advancements in technology.