The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2006
Filed:
Jun. 28, 2004
Applicants:
Yu-fang Tsai, Kaohsiung, TW;
Jung-kun Kang, Kaohsiung, TW;
Tsung Yueh Tsai, Kaohsiung, TW;
Inventors:
Assignee:
Advanced Semiconductor Engineering, Inc., Kaoshiung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A manufacturing method of a ball grid array package mainly comprises providing a carrier unit with an upper surface and a lower surface, mounting a plurality of solder balls on the lower surface of the carrier unit, disposing a protective layer below the lower surface to cover the solder balls, placing a chip on the upper surface of the carrier unit and electrically connecting the carrier and the chip, encapsulating the chip and removing the protective layer so as to form said ball grid array package.