Seongnam, South Korea

Jung Il Park

This inventor holds 1 USPTO granted patent. Top assignee: Won Tech Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jung Il Park. Retrieved from https://idiyas.com/inventor/jung-il-park-iugfs0o5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jung Il Park and His Patent for a High-Frequency Output Device

Introduction

Jung Il Park is an inventor associated with Seongnam, South Korea, and Won Tech Co., Ltd. His patent work includes a device designed to deliver high-frequency output through an invasive tip with an array of needles.

Latest Patents

Park is credited with 1 patent. His patent, “High Frequency Output Device and Invasive Tip Therefor,” describes an invasive tip built around a substrate with a needle array extending from one surface and conductive pins extending from the other. Wiring in the substrate electrically connects the pins to the needle array.

The design also includes a bracket that supports the substrate and guides the conductive pins, along with a housing that accommodates the bracket. The housing has through holes at one end and a surrounding side wall shaped so its horizontal cross-sectional area narrows toward that end.

Career Highlights

Park’s documented patent activity highlights his contribution to the design of a high-frequency output device and its invasive tip. The patent’s structural details address how the needle array, electrical connections, bracket, and housing fit together.

Collaborations

Park is associated with Won Tech Co., Ltd. The available information identifies the company but does not specify further details about his role or particular collaborations.

Conclusion

Jung Il Park’s patent presents an integrated design for a high-frequency output device, combining a wired needle array with supporting and protective components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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