The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 06, 2026

Filed:

Oct. 11, 2024
Applicant:

Wontech Co., Ltd., Daejeon, KR;

Inventors:

Jong Won Kim, Seongnam, KR;

Jung Hyun Kim, Seongnam, KR;

Young Seok Seo, Sejong, KR;

Jung Il Park, Seongnam, KR;

Ye Chan Nam, Uiwang, KR;

Assignee:

WONTECH CO., LTD., Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 18/14 (2006.01); A61B 18/00 (2006.01); A61B 90/00 (2016.01);
U.S. Cl.
CPC ...
A61B 18/14 (2013.01); A61B 90/03 (2016.02); A61B 2018/00077 (2013.01); A61B 2018/00083 (2013.01); A61B 2018/0016 (2013.01); A61B 2018/00184 (2013.01); A61B 2018/0047 (2013.01); A61B 2018/00702 (2013.01); A61B 2018/143 (2013.01); A61B 2018/1467 (2013.01); A61B 2018/1475 (2013.01); A61B 2090/034 (2016.02);
Abstract

A high frequency output device and an invasive tip therefor are proposed, and the invasive tip includes a substrate, a needle array extending from a first surface of the substrate, one or more conductive pins extending from a second surface of the substrate, a bracket for supporting the substrate and guiding the one or more conductive pins, and a housing configured to accommodate the bracket inside thereof, have a plurality of through holes formed in a first end thereof opposite the first surface, and have a side wall formed to surround the needle array between the first end and a second end, the side wall having a shape of an inclined surface whose horizontal cross-sectional area decreases from a first point on the side wall to the first end, wherein the substrate includes wiring for electrically conductively connecting the one or more conductive pins to the needle array.


Find Patent Forward Citations

Kim, Jong. (2026). High frequency output device and invasive tip therefor (U.S. Patent No. 12751759). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12751759

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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