This inventor holds 1 USPTO granted patent. Top assignee: Industrial Technology Research Institute. Active years: 2007.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2007
Title: Innovations of Jung-Hua Wei: Advancements in Electroplated Interconnection Wires
Introduction: Jung-Hua Wei is an accomplished inventor based in Hsinchu, Taiwan, known for his pioneering work in the field of electroplated interconnection wires. With a focus on integrating advanced materials, he holds a patent that significantly enhances the functionality and efficiency of electrical connections through the use of carbon nanotubes.
Latest Patents: Wei's notable patent is titled "Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes." This innovative technique involves electroplating a conductive baseline on a substrate in an electroplating bath containing metal ions and carbon nanotubes. This process not only creates a robust electroplated interconnection wire but also showcases the synergistic properties of combining metals with carbon nanotubes. Moreover, an alternative method includes preparing a dispersion of carbon nanotubes in an organic solvent, which is then printed onto the substrate, further enhancing the effectiveness of the conductive baseline.
Career Highlights: Jung-Hua Wei is a key figure at the Industrial Technology Research Institute, where he contributes his expertise and creativity to the development of cutting-edge technologies. His work focuses on improving material properties and manufacturing processes, which play a crucial role in advancing the electronics industry.
Collaborations: Throughout his career, Wei has collaborated with esteemed colleagues such as Po-Yuan Lo and Bae-Horng Chen. These partnerships reflect a shared commitment to innovation and excellence within the fields of materials science and electrical engineering.
Conclusion: With a strong foundation in materials technology and a passion for innovation, Jung-Hua Wei continues to make significant contributions to the advancement of electroplated interconnection wires. His patented methods not only pave the way for enhanced electrical connectivity but also highlight the importance of integrating novel materials like carbon nanotubes in modern applications. As the electronics industry evolves, Wei's work serves as a testament to the drive for progress through inventive thinking.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
