The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7226531 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 05, 2007

Filed:

Dec. 12, 2005
Applicants:

Po-yuan Lo, Hsinchu, TW;

Jung-hua Wei, Hsinchu, TW;

Bae-horng Chen, Hsinchu, TW;

Jih-shun Chiang, Hsinchu, TW;

Chian-liang Hwang, Hsinchu, TW;

Ming-jer Kao, Hsinchu, TW;

Inventors:

Po-Yuan Lo, Hsinchu, TW;

Jung-Hua Wei, Hsinchu, TW;

Bae-Horng Chen, Hsinchu, TW;

Jih-Shun Chiang, Hsinchu, TW;

Chian-Liang Hwang, Hsinchu, TW;

Ming-Jer Kao, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 5/02 (2006.01); C25D 5/56 (2006.01);
U.S. Cl.
CPC ...
Abstract

Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes is disclosed, including electroplating a substrate having a conductive baseline on a surface thereof in an electroplating bath containing a metal ion and carbon nanotubes, so that an electroplated interconnection wire of a composite of the metal and carbon nanotubes is formed on the conductive baseline. Alternatively, a method of the present invention includes preparing a dispersion of carbon nanotubes dispersed in an organic solvent, printing a baseline with the dispersion on a surface of a substrate, evaporating the organic solvent to obtain a conductive baseline, and electroplating the surface in an electroplating bath containing a metal ion, so that an electroplated interconnection wire of a composite of the metal and carbon nanotubes is formed on the conductive baseline.


Find Patent Forward Citations

Lo, Po-Yuan. (2007). Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes (U.S. Patent No. 7226531). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7226531

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