Hsinchu, Taiwan

Bae-Horng Chen


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: **Innovative Contributions of Bae-Horng Chen in Electroplated Interconnection Technology**

Introduction

Bae-Horng Chen, an accomplished inventor based in Hsinchu, Taiwan, has made significant strides in the field of electroplating technology. His notable innovation focuses on the creation of an electroplated interconnection wire that utilizes a composite of metal and carbon nanotubes, promising advancements in the performance and efficiency of electronic components.

Latest Patents

Bae-Horng Chen holds one patent titled "Method of Making an Electroplated Interconnection Wire of a Composite of Metal and Carbon Nanotubes." This innovative method involves electroplating a substrate with a conductive baseline in an electroplating bath comprising metal ions and carbon nanotubes. This process enables the formation of robust electroplated interconnection wires that leverage the unique properties of carbon nanotubes, enhancing the electrical conductivity and mechanical strength of the wires. An alternative method described in the patent encompasses preparing a dispersion of carbon nanotubes in an organic solvent, printing a baseline onto a substrate surface, and then electroplating to achieve the desired composite wire structure.

Career Highlights

Bae-Horng Chen is currently associated with the Industrial Technology Research Institute, a prominent research institution dedicated to pioneering technological advancements in various fields. His work is instrumental in bridging the gap between theoretical research and practical applications in electroplating technology.

Collaborations

Throughout his career, Bae-Horng Chen has collaborated with esteemed colleagues such as Po-Yuan Lo and Jung-Hua Wei. These collaborations have contributed to the enhancement and refinement of his innovative methodologies, strengthening the impact of their research initiatives within the industry.

Conclusion

Bae-Horng Chen's pioneering work in electroplated interconnection technology exemplifies the vital role of inventors in fostering innovation within the electronics sector. His method not only pushes the boundaries of material science but also lays the groundwork for future advancements in electronic components, making his contributions invaluable to the field.

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