Jung-Do Kim

Title: Innovations of Jung-Do Kim in Semiconductor Technology

Introduction

Jung-Do Kim is a notable inventor based in Yongin-si, South Korea, recognized for his contributions to semiconductor technology. With a total of two patents to his name, he has made significant advancements in the field, particularly in lead frame and semiconductor device design.

Latest Patents

One of his latest patents is focused on a lead frame and semiconductor device that features an improved wire bonding property of inner leads and enhanced soldering property of outer leads. This innovation aims to prevent defects while achieving a high production yield. The lead frame includes a plurality of inner leads formed with predetermined intervals and outer leads that extend from the inner leads, ensuring a robust connection.

Another significant patent involves a flat chip semiconductor device and its manufacturing method. This flip chip semiconductor device boasts an improved structure that allows for a more secure connection between the semiconductor chip and the lead frame, minimizing contact defects. The design includes conductive bumps on the electrode pads of the semiconductor chip and a lead frame with grooves that enhance the connection's reliability.

Career Highlights

Jung-Do Kim is currently employed at Samsung Techwin Co., Ltd., where he continues to innovate in semiconductor technology. His work has contributed to the advancement of manufacturing processes and device reliability in the industry.

Collaborations

He has collaborated with notable colleagues such as Kwang-suk Park and Soo-bong Lee, further enhancing the innovative capabilities of his team.

Conclusion

Jung-Do Kim's contributions to semiconductor technology through his patents reflect his expertise and commitment to innovation. His work at Samsung Techwin Co., Ltd. continues to influence the industry positively.