The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2009
Filed:
May. 20, 2005
Soo-bong Lee, Yongin-si, KR;
Jung-do Kim, Yongin-si, KR;
Woo-suk Choi, Yongin-si, KR;
Eun-hee Kim, Yongin-si, KR;
Soo-bong Lee, Yongin-si, KR;
Jung-Do Kim, Yongin-si, KR;
Woo-suk Choi, Yongin-si, KR;
Eun-hee Kim, Yongin-si, KR;
Samsung Techwin Co., Ltd., , KR;
Abstract
Provided is a lead frame having an improved wire bonding property of inner leads and an improved soldering property of outer leads and preventing defects with high producing yield, and a method of manufacturing the lead frame. The lead frame includes a plurality of inner leads formed with predetermined intervals between them; and a plurality of outer leads extended from the inner leads in length directions of the inner leads, each of which has an end portion overlapped with the inner lead and coupled thereto and the other end connected to neighboring outer lead by a supporting portion.