Jiangmen, China

Junda Deng

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Wuyi University. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Junda Deng. Retrieved from https://idiyas.com/inventor/junda-deng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 9.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Junda Deng: Innovator in Robotics

Introduction

Junda Deng is a notable inventor based in Jiangmen, China. He has made significant contributions to the field of robotics, particularly with his innovative designs and methods. His work focuses on enhancing efficiency and functionality in robotic systems.

Latest Patents

Junda Deng holds a patent for a "Ball picking robot and ball unloading method using the same." This invention features a sophisticated ball picking robot that includes a chassis, an L-shaped hanging lug, a ball storage frame, an electric push rod, a baffle, a bracket, and a drive motor. The design allows for effective ball picking and unloading, showcasing his ingenuity in robotic applications.

Career Highlights

Deng is affiliated with Wuyi University, where he continues to advance his research and development in robotics. His work has garnered attention for its practical applications and innovative approach to solving complex problems in automation.

Collaborations

Junda Deng collaborates with talented colleagues, including Tianlei Wang and Jiongzhi Qiu. Their combined expertise contributes to the advancement of their projects and enhances the research environment at Wuyi University.

Conclusion

Junda Deng's contributions to robotics exemplify the spirit of innovation and creativity. His patent for the ball picking robot demonstrates his commitment to advancing technology in practical ways.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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