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For the Inventor, By the Inventor

Palo Alto, CA, United States of America

Jun Zeng

This inventor holds 97 USPTO granted patents and 51 published patent applications and 23 EPO patents, primarily in Additive Manufacturing (CPC class B33Y50-00). Top assignees: Hewlett-Packard Development Company, L.p., Peridot Print LLC, Instituto Atlantico. Active years: 2010-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jun Zeng. Retrieved from https://idiyas.com/inventor/jun-zeng-xz6mw4ab

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 97 

% Patents Active = 71.1

 

Average Co-Inventor Count = 3.5

ph-index = 4

Forward Citations = 67(Granted Patents)

Forward Citations (Not Self Cited) = 51(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Corvallis, OR (US) (2010 - 2013)
  • Sunnyvale, CA (US) (2014 - 2022)
  • Palo Alto, CA (US) (2017 - 2024)
  • Los Gatos, CA (US) (2024)

Company Filing History:

goldMedal81 out of 27,679 
 
Hewlett-Packard Development Company, L.p.
 patents
silverMedal15 out of 158 
 
Peridot Print LLC
 patents
bronzeMedal5 out of 6 
 
Instituto Atlantico
 patents
4. 2 out of 684 
 
Nanyang Technological University
 patents
where one patent can have more than one assignee

Years Active: 2010-2026

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Areas of Expertise:
3D Printing
Thermal Mapping
Material Phase Detection
Point Cloud Alignment
Adaptive Simulation
Thermal Image
Porosity Prediction
Model Prediction
Object Deformation
Parts Packing
Temperature Prediction
Neural Network
97 patents (USPTO):Explore Patents
1. 12761629 - Element placement on 3D surfaces (2026-10-13),
2. 12761628 - Object packings with volume subsets (2026-10-13),
3. 12759235 - Determining powder degradation (2026-10-13),
4. 12728600 - 3D structures to encapsulate build material (2026-09-08),
5. 12686974 - Fiber molding screen pore trajectory (2026-07-21),
6. 12686056 - Part packing with diffusion auras (2026-07-21),
7. 12651100 - Generating supports (2026-06-09),
8. 12649281 - Agent maps (2026-06-09),
9. 12633056 - Maps to encode displacements in digital 3D model (2026-05-19),
10. 12629890 - 3D printer fresh and recycled powder supply management (2026-05-19),
11. 12547148 - Displacement maps (2026-02-10),
12. 12523983 - Point cloud alignment (2026-01-13),
13. 12487580 - Thermal image determination (2025-12-02),
14. 12459041 - Porosity prediction (2025-11-04),
15. 12373618 - Adaptive simulation in additive manufacturing (2025-07-29),

Title: Inventor Jun Zeng: Pioneering Innovations in Palo Alto

Introduction: Jun Zeng is a visionary inventor based in Palo Alto, California, known for his groundbreaking contributions to the field of technology and beyond.

Latest Patents: Jun Zeng holds several patents in various industries, including artificial intelligence, renewable energy, and healthcare technologies.

Career Highlights: With a career spanning over two decades, Jun Zeng has worked with leading tech companies, research institutions, and universities to develop cutting-edge solutions that have revolutionized the way we live and work.

Collaborations: Jun Zeng has collaborated with top researchers, engineers, and scientists worldwide, fostering a culture of innovation and excellence in all his projects.

Conclusion: Jun Zeng's relentless pursuit of innovation and his passion for creating a better future through technology make him a true pioneer in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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