Jun Rae Park

Title: Jun Rae Park and Integrated-Circuit Cooling Innovation

Introduction

Jun Rae Park is an inventor associated with Ansan, South Korea, and Chung Ang University Industry Academic Cooperation. His work includes a patent for a direct cooling device for integrated circuits and a method for manufacturing it.

Latest Patents

Park is credited with 1 patent: “Direct Cooling Device for Integrated Circuit and Manufacturing Method Thereof.” The invention describes a cooling portion with a channel for cooling fluid, formed in a through-via hole in the integrated-circuit substrate. A bonding portion integrates the cooling structure with a heat-sink unit.

Unlike approaches that use the through-via hole only for grounding, this design enables direct cooling of the semiconductor device as well as the ground circuit. The described benefits include improved thermal management and product reliability, along with a simpler, more compact structure that avoids the need for a separate cooling-flow path.

Career Highlights

Park’s patent reflects an approach to semiconductor thermal management that combines cooling and grounding functions within the integrated-circuit structure. The patent record identifies Chung Ang University Industry Academic Cooperation as his associated organization.

Collaborations

Park’s listed coworkers include Min Soo Kang and Hae Cheon Kim. Their names are provided as collaborators associated with his professional work.

Conclusion

Jun Rae Park’s patented cooling concept integrates fluid-based heat management into an integrated-circuit substrate, aiming to improve reliability while reducing structural complexity.