The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Feb. 04, 2024
Chung-ang University Industry Academic Cooperation Foundation, Seoul, KR;
Min Soo Kang, Seoul, KR;
Jun Rae Park, Ansan-si, KR;
Hae Cheon Kim, Daejeon, KR;
Hyoung Soon Lee, Seoul, KR;
Sung Jae Chang, Daejeon, KR;
Hyun Wook Jung, Daejeon, KR;
Il Gyu Choi, Jeonju-si, KR;
Seong Il Kim, Daejeon, KR;
Sang Heung Lee, Daejeon, KR;
Ho Kyun Ahn, Daejeon, KR;
Jong Won Lim, Daejeon, KR;
Abstract
Provided is a direct cooling device for an integrated circuit configured to form a direct cooling portion with a flow channel through which cooling fluid may flow in a through via hole of a substrate constituting the integrated circuit, and to couple the substrate to a heat sink unit through a bonding portion formed integrally with the direct cooling portion, unlike the prior art in which only a ground circuit is possible through the through via hole, which derives the effect of increasing product reliability due to improved thermal management efficiency of the integrated circuit by directly cooling the semiconductor device as well as the ground circuit, and the effect of simplifying and miniaturizing the structure by implementing the cooling function using a circuit for grounding the semiconductor device even without forming an additional flow path structure for cooling the semiconductor device.