Jun-Oh Hwang

Title: Innovations of Jun-Oh Hwang in Printed Circuit Board Technology

Introduction

Jun-Oh Hwang is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of printed circuit board technology, holding 2 patents that showcase his innovative approach to design and manufacturing.

Latest Patents

Hwang's latest patents include a printed circuit board assembly and a method for manufacturing a printed circuit board. The printed circuit board assembly patent describes a system that includes a first printed circuit board, a second printed circuit board, and a space holding member. This design allows for improved spacing and connection between the two boards, enhancing overall functionality. The method of manufacturing a printed circuit board focuses on creating a high-efficiency board with effective heat emission. This is achieved by incorporating a heat sink in direct contact with the board, which is a significant advancement in the field.

Career Highlights

Jun-Oh Hwang is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to develop innovative solutions in electronics. His work has been instrumental in advancing the capabilities of printed circuit boards, making them more efficient and reliable.

Collaborations

Hwang collaborates with talented coworkers, including Jae-Ho Shin and Yun-Je Ji, who contribute to the innovative environment at Samsung Electro-Mechanics Co., Ltd. Their teamwork fosters creativity and leads to groundbreaking advancements in technology.

Conclusion

Jun-Oh Hwang's contributions to printed circuit board technology reflect his dedication to innovation and excellence. His patents not only enhance the functionality of electronic devices but also pave the way for future advancements in the industry.