The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2012
Filed:
Jan. 12, 2009
Jun-oh Hwang, Busan, KR;
Jee-soo Mok, Yongin-si, KR;
Jun-heyoung Park, Hwaseong-si, KR;
Kyung-ah Lee, Seoul, KR;
Eung-suek Lee, Ansan-si, KR;
Jun-Oh Hwang, Busan, KR;
Jee-Soo Mok, Yongin-si, KR;
Jun-Heyoung Park, Hwaseong-si, KR;
Kyung-Ah Lee, Seoul, KR;
Eung-Suek Lee, Ansan-si, KR;
Abstract
A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile