Company Filing History:
Years Active: 2018-2019
Title: Jun-Ming Chen: Innovator in Semiconductor Technology
Introduction
Jun-Ming Chen is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing semiconductor structures and methods for defect review.
Latest Patents
One of his latest patents is titled "Die," which describes a semiconductor structure that includes a wafer comprising a plurality of viewing fields defined thereon. This structure features a plurality of dies defined by a scribe line formed in each viewing field, along with a plurality of mark patterns formed in the scribe line. Additionally, it includes a plurality of anchor patterns respectively formed in the review fields, with the anchor patterns being different from the mark patterns. Another notable patent is "Method for Reviewing Defects," which similarly outlines a semiconductor structure with multiple viewing fields and dies, emphasizing the importance of the mark and anchor patterns in defect detection.
Career Highlights
Jun-Ming Chen is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His innovative work has positioned him as a key figure in advancing semiconductor technology.
Collaborations
Throughout his career, Jun-Ming has collaborated with talented individuals such as Yung-Teng Tsai and Hung-Chin Lin. These collaborations have further enriched his contributions to the field.
Conclusion
Jun-Ming Chen's work in semiconductor technology exemplifies innovation and dedication. His patents reflect a commitment to improving semiconductor structures and methods, making a lasting impact in the industry.