Jun Li

Title: Jun Li - Innovator in Electronic Component Mounting Solutions

Introduction

Jun Li is a notable inventor based in Shenzhen, Taiwan. He has made significant contributions to the field of electronic apparatus design, particularly in the area of mounting devices for heat sinks. His innovative approach has led to the development of a patent that enhances the efficiency of electronic components.

Latest Patents

Jun Li holds a patent for a "Mounting device for mounting heat sink onto electronic component." This invention involves an electronic apparatus that includes a printed circuit board (PCB) with a heat-generating electronic component, a heat sink, and a specialized mounting device. The mounting device features a mounting frame that surrounds the heat sink and includes first and second mounting arms. The design ensures that the heat sink is securely attached to the electronic component, optimizing thermal management in electronic devices.

Career Highlights

Throughout his career, Jun Li has worked with prominent companies in the technology sector. He has been associated with Fu Zhun Precision Industry (Shenzhen) Co., Ltd. and Foxconn Technology Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Jun Li has collaborated with talented individuals in his field, including Jer-Haur Kuo and Xin-Xiang Zha. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Jun Li's contributions to the field of electronic component design, particularly through his patented mounting device, demonstrate his commitment to innovation. His work continues to influence the efficiency of electronic apparatuses, making him a significant figure in the industry.