Suwon-si, South Korea

Jun Kyoung Lee

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jun Kyoung Lee. Retrieved from https://idiyas.com/inventor/jun-kyoung-lee-5s1foatf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jun Kyoung Lee: Semiconductor Device Manufacturing Inventor

Introduction

Jun Kyoung Lee is an inventor based in Suwon-si, South Korea. He works at Samsung Electronics Ltd. and is associated with 1 patent concerning semiconductor device manufacturing.

Latest Patents

Lee’s patent, “Semiconductor Device Manufacturing Method and Semiconductor Device Manufactured Using the Same,” describes a process for forming lower and upper chips and bonding them together. The method forms trenches in the chips’ interlayer insulating and adhesive films, then uses sputtering to create first and second seed films for each chip.

Career Highlights

Lee’s disclosed work focuses on semiconductor fabrication and chip bonding. The patent outlines manufacturing steps for both lower and upper chips, including substrate preparation, film formation, trench etching, and seed-film deposition.

Collaborations

Lee’s listed coworkers include Tae Seong Kim and Ho-Jin Lee. The patent’s disclosed manufacturing process is associated with Samsung Electronics Ltd.

Conclusion

Jun Kyoung Lee’s patent documents his contribution to semiconductor device manufacturing, particularly the formation and bonding of upper and lower chips.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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