Pyeongtaek-si, South Korea

Jun-Ha Hwang

USPTO Granted Patents = 1 

Average Co-Inventor Count = 10.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Jun-Ha Hwang: Innovator in Semiconductor Polishing Technologies

Introduction

Jun-Ha Hwang, based in Pyeongtaek-si, South Korea, is a notable inventor known for his contributions to the semiconductor manufacturing industry. With a focus on enhancing the efficiency of semiconductor devices, Hwang has successfully developed a patented invention that showcases his innovative prowess.

Latest Patents

Hwang holds a patent titled "Polishing compositions and methods of manufacturing semiconductor devices using the same." This invention presents a novel polishing composition that comprises abrasive particles, a pyrrolidone containing a hydrophilic group, a dispersing agent, a first dishing inhibitor made of polyacrylic acid, and a second dishing inhibitor composed of a non-ionic polymer. This unique formulation aims to improve the polishing process essential for semiconductor device manufacturing.

Career Highlights

Throughout his career, Jun-Ha Hwang has been affiliated with reputable companies, most notably Samsung Electronics Co., Ltd. and K.C. Tech Co., Ltd. His work at these firms has focused on refining processes and developing technologies that meet the evolving standards of the semiconductor industry.

Collaborations

In his professional journey, Hwang has collaborated with distinguished coworkers, including Seung-Ho Park and Ki-Hwa Jung. These collaborations have fostered an environment of innovation and have contributed significantly to their shared accomplishments in semiconductor technology.

Conclusion

Jun-Ha Hwang's contributions to semiconductor polishing technologies highlight his status as a leading inventor in this field. With a patent that underlines practical applications and efficient manufacturing processes, Hwang continues to push the boundaries of innovation, benefiting the semiconductor industry and paving the way for future advancements.

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