Julien Cuzzocrea

Title: Julien Cuzzocrea: Integrated Circuit Packaging Innovation

Introduction

Julien Cuzzocrea is an inventor based in Montbonnot-Saint-Martin, France. His patent work includes an integrated circuit package designed to improve heat management in electronic devices. He is associated with STMicroelectronics (Grenoble 2) SAS and has 1 patent listed in the information provided.

Latest Patents

Cuzzocrea’s patent, “Integrated Circuit Package,” describes a package with a base substrate and at least one electronic chip mounted on it. The chip can generate localized hot spots during operation, creating regions where heat needs to be managed.

A coating encapsulates the chip and has a profiled top face. Part of that profile locally reduces the coating’s volume in an area corresponding at least partly to the chip’s heat-generating region. A heat sink is mounted on the profiled surface using a mounting layer. This design focuses on positioning the heat sink in relation to the chip’s hot spots.

Career Highlights

Cuzzocrea’s listed invention addresses thermal management in integrated circuit packaging. The patent describes a structural approach that combines an encapsulating coating, a shaped surface, and a heat sink to address heat generated by electronic components.

Collaborations

Cuzzocrea is associated with STMicroelectronics (Grenoble 2) SAS. Younes Boutaleb is identified as a coworker.

Conclusion

Julien Cuzzocrea’s patent presents an integrated circuit packaging design that uses a profiled coating and a mounted heat sink to address localized heat from electronic chips.